Bluetooth Intelligent Serial Modules with Power Amplifiers

Applications
POS Equipment
Medical Equipment
Telematics
Voice Applications
Industrial Automation
Automotive Applications

General Description
The BISM II PA Bluetooth® serial module is a fully integrated and qualified Class 1 Bluetooth® solution, incorporating a power amplifier and low noise amplifier that maximises the RF link budget. It's designed for lowest cost of integration and ownership for designers wishing to incorporate Bluetooth® functionality into their products.

The BISM II PA is qualified to Bluetooth® Version 2.0.

This module is one of the most compact complete Bluetooth® solutions, making it ideal to integrate into handheld devices. It includes a high sensitivity, high gain antenna which provides excellent range. Typical open field performance provides ranges of up to 1,000 metres at transmit powers of 65mW.

The BISM II PA is based on Cambridge Silicon Radio's BlueCore™4 chipset. It contains all of the hardware and firmware for a complete Bluetooth® solution, requiring no further components. It has an integrated, high performance antenna matched with the Bluetooth RF and baseband circuitry. The firmware integrated into the chipset implements the higher layer Bluetooth protocol stack, with support for applications requiring Generic Access Profile (GAP), Service Discovery Profile (SDAP), Serial Port Profile(SPP), Dial Up Networking Profile (DUN), Headset Profile (HSP), Hands Free Profile (HFP), File Transfer Profile (FTP) and OBEX (Client).

A virtual processor is used within the BC04 to implement an AT command processor. This interfaces to the host system over a serial port using an extensive range of AT commands. The AT command set abstracts the Bluetooth protocol from the host application, saving months of programming and integration time. Firmware providing programming support for multipoint applications is also included. A low cost development system is available.

Support is provided for low power modes that make the BISM II PA particularly applicable to battery powered installations. It can be configured to be attached to a dumb terminal or to a PC or PDA for cable replacement applications.

In addition to the Bluetooth functionality, the module provides access to 7 general I/O lines and 2 analogue input lines. These can be configured for connection to simple devices such as switches or LEDs without any external processor. The GPIO and ADC lines can be accessed either via the wired host UART connection or remotely over the Bluetooth link.

The BISM II PA is supplied in a small form factor pcb (22.0 x 34.0 x 7.6) that connects to a main pcb via a 40-way Hirose connector.

The module is Pb-free and RoHS compliant and has a temperature range of -10°C to +85°C. A key feature of the module's design is pin and format compatibility with Laird Technologies' WLAN modules. This allows designers to make a single version of their pcb to accept either a Bluetooth or 802.11 module, greatly reducing development time.